玻璃基板用設備
雷射改質設備
雷射改質設備 Laser modification machine
- Device Size: 1,300 x 1,600 x 1,900
- Panel Size: ~600 x 600 mm
- Position Accuracy: ±2 µm ~ ±10 µm
- Standard Tack Time: 14,000 holes/sec
- Aspect Ratio: 10 ~ 50 (depends on glass type)
- Taper Angle: 75° ~ 88°
TGV維修機
TGV維修機 TGV Repair Machine
- Panel Size: ~600 mm x 600 mm
- Laser Type: Excimer Laser (193 nm)
- Process Head Type: Focus
- Stage Type: Stack
- Position Accuracy: ±5 µm
- Max. Process Time: 20 holes/min
- Hole Taper: < 3°
- Roundness: ≒ 1.0 µm
化學蝕刻機
化學蝕刻機 Etching System
- Device Size: 12,000 x 3,800 x 3,200
- Panel Size: ~600 x 600 mm
- Semi-Auto: Chemical process + Rinsing + Dry
- Standard Tack Time: 6 panels/hr (0.5t, 350,000 holes)
- Taper Angle: 75° ~ 88°
TGV檢查機
TGV Inspection Machine TGV檢查機
Main Features
- 3 Layer Simultaneous Scanning
- No Need to Turn-Over
- Non-Contact
- High Speed Inspection
- 3D Metrology, TTV
- After Laser Modification Inspection: (Mis-fire, Double-fire)
- AI Verification, Heat Mapping
- Laser Auto Focusing
- Group Picture Function
Measuring & Inspection Items
- Via Diameter
- Roundness
- Via True Position
- Top to Bottom Concentricity
- Taper Angle
- Cavity Measuring Including Radius
- Pimple & Dimple
- Corner Angle
- Particle
- Scratch & Chipping
- Cu Plating Recess
- Edge Profile
- Total Pitch
玻璃基板自動撕膜機
玻璃基板自動撕膜機 Glass Substrate Auto peeler
