玻璃通孔 (TGV) 代工服務
玻璃通孔 (TGV) 代工服務
TGV Foundry Total Service 玻璃通孔 (TGV) 代工服務
- 雷射改質 Laser Modification
- 化學蝕刻 Chemical Etching
- 金屬化(銅填充) Metallization(Cu Filling)
- 化學機械拋光 CMP
- 腔體(盲孔,貫通) Cavity (Blind, Through)
LMCE® 技術
High Tech/Quality Microstructured Glass Materials with LMCE® Technology
For superfast computing performance, semiconductor packaging is getting more integrated. Our LMCE®* technology can provides microstructured glass wafer for semiconductor, MEMS and mold, etc.
About LMCE®
LMCE® is the Joongwoo M-tech’s technology for processing glass with special laser treatment. It has good performance for drilling hole on glass and takes advantage of crack-free.
Advantages of glass products
for semiconductor, MEMS and etc.
- Higher performance for mechanical, thermal and chemical
- Low dielectric constant
- Small distance of hole to hole – With laser + chemical drilling technology
- Very tiny via hole *3) -4) Available with LMCE® Technology
LMCE® (Laser Modification Chemical Etching)
LMCE® Hole Specification
產品展示
照片展示
T Series
TP Series #1
TP Series #2
TPC Series
